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TASK Micro-Electronics Inc.

Laval, Québec

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À propos de TASK Micro-Electronics Inc.

Innovating Design Solutions & Micro Assemblies for High-end Industries.

Secteur
Appliances, Electrical, and Electronics Manufacturing
Taille de l’entreprise
51 à 200 employés
Siège social
Montreal, Quebec
Fondation
1987
Type d’entreprise
Entreprise privée

Présentation originale de l’entreprise

TASK provides innovative solutions to customers in need of high reliability miniaturization using state of the art assembly processes for manufacturability, specializing in Medical, Aerospace, Defense & Security and some high-end industrial markets.

With over 35 years of deep industry experience in microelectronics, our core competencies allow sequential steps for design, proto, NPI, to volume production.

Design & process engineering services: To get your complex devices to market faster, TASK’s products engineering team has the experience in helping customers miniaturize and/or ruggedize their new or existing designs with innovative packaging solutions based in the most current technologies. TASK works in conjunction with customers from initial design layout through validation, prototype, pre-production phases right to full production support.

Complex multi process assemblies: Non-standard assembly challenge? One of a kind packaging needs? Combining multiple processes into a tiny solution? Our team has extensive experience from simple assemblies to complex combinations required to make your product work effectively. Thick film, SMT, die-attach, wire bonding, electrical test, encapsulation – or any combination of… Tell us your requirements, we will find a solution!

Quality & Compliance: Quality comes from good documentation & processes. Our compliance adheres to ISO 13485:2016 / ISO 9001:2015 certified, AS9100D certified, FDA audited and registered, Medical Implantable devices, CGP, IPC-A-610, FAR/DFAR and MIL-STD-883 compliant.

Do not hesitate to contact us at: sales@TASKmicro.com to discuss your design and manufacturing needs.

Spécialités

  • Microelectronics packaging
  • Encapsulation
  • Flip-Chip
  • Die-Attach processes
  • Thin wire-bonding
  • Ball bonding
  • Wedge bonding
  • Ruggedized applications
  • Ceramic
  • Thick film
  • HTCC
  • SiP and MCM
  • Sensors assembly
  • Precision SMT
  • Miniaturization
  • Medical devices
  • Aerospace
  • Robotics
  • ISO13485
  • FDA registered
  • Engineering services
  • Photonics
  • Heavy gauge wire-bonding
  • thin pitch assembly
  • Microelectronics
  • Hybrid circuits
  • Bare die circuits
  • Print and Fire
  • Thick film hybrid circuits
  • Multi-layer screen printing
  • Cleanroom
  • AS9100D
  • and ISO9001

Établissements

  • 16700 Trans Canada Hwy, Montreal, Quebec H9H, CA

Les emplacements du profil de l’entreprise peuvent être hors de cette zone. Ils ne recrutent pas tous.

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1 175
Personnes liées à cette entreprise
38

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